IACSIT Components, Packaging & Manufacturing Society (CPMS)
www.iacsit.org/society/cpms.htm

  CPMS Mission

The IACSIT Components, Packaging & Manufacturing Society (CPMS) is organized for the engineers and the scholars in the Components, Packaging & Manufacturing discipline. Through regularly scheduled conferences and workshops on the Components, Packaging & Manufacturing, the IACSIT Components, Packaging & Manufacturing Society serves as a forum for networking, information sharing, idea exchange and problem solving for the Components, Packaging & Manufacturing community.

  CPMS Task

The committee members of the IACSIT Components, Packaging & Manufacturing Society (CPMS) can voluntarily organize different activities for its Society members, and take part in organizing the IACSIT conferences and workshops. The IACSIT Components, Packaging & Manufacturing Society has been taking part in the organizing of different IACSIT conferences, for example, 2009 International Conference on Semi-Conductor Technology (ICSCT 2009). Their details are available at:

18-19 Dec 2009: ICSCT 2009	2009 International Conference on Semi-Conductor Technology	Jeju Island, Korea	Aug. 20, 2009
22-24 Jan 2009: MIMT 2010	2010 International Conference on Mechanical, Industrial, and Manufacturing Technologies	Sanya, China	Sep. 25, 2009
26-28 Feb 2010: NOPT 2010	2010 International  Conference on Nanotechnology, Optoelectronics and Photonics Technologies	Singapore	Oct. 20, 2009

  About IACSIT

IACSIT  is a registered non-profit international scientific association of distinguished scholars engaged in Computer Science and Information Technology. The IACSIT members include research and development center heads, faculty deans, department heads, professors, research scientists, engineers, scholars, experienced software development directors, managers and engineers, and university postgraduate and undergraduate engineering and technology students, etc. IACSIT plays an influential role and promotes developments in Computer Science and Information Technology in a wide range of ways. The mission of IACSIT is to foster and conduct collaborative interdisciplinary research in state-of-the-art methodologies and technologies within its areas of expertise. All papers in IACSIT conference proceedings will be published by the well known press, such as IEEE, Academic Press, Springer, ASME, World Scientific Press, Atlantis Press, IACSIT Press and SPIE, and will be submitted to the major indexing services for indexing.

  IACSIT Components, Packaging & Manufacturing Society (CPMS) Committees

Dr. Apurba Laha
Leibniz University, Germany

Prof. Yin Changyong
Shenyang Institute of Engineering (SIE), China

Dr. Shilpi Birla
Sir Padampat Singhania University, India

Dr. Mir Sadat Ali
Biju Patnaik Technical University, India

Dr. Mohan Kumar Pradhan
National Institute of Technology, Rourkela, India

Dr. VIRANJAY M. SRIVASTAVA
Jaypee Universityof Information Technology, India

Dr. Ahmed Sayed
IBM Center of Advanced Studies, Egypt

  Contact

E-mail: iacsitcpms@gmail.com

Interested IACSIT members and other scientists can join the CPMS free of charge by filling the online application:

http://www.iacsit.org/member.htm